AN ADHESION TEST FOR ELECTROPLATES

Authors
  1. McIntyre, J.D.
  2. McMillan, A.F.
Corporate Authors
Naval Research Establishment, Dartmouth NS (CAN)
Abstract
A technique is presented which measures the adhesion of copper plate in the shear direction, provided that the adhesion is not greater than the strength of solder. In addition, this test may be used to measure the shear strength of solder.
Keywords
Copper plating;Mechanical properties;Electroplating
Date of publication
13 Jan 1956
Number of Pages
4
Reprinted from
Canadian Journal of Technology, vol 34, 1956, p 212-214
DSTKIM No
57-02887
CANDIS No
143350
Format(s):
Hardcopy

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