Micro-Electro-Mechanical-Systems for Sensor Applications

PDF

Authors
  1. Rinaldi, G.
Corporate Authors
Defence R&D Canada - Atlantic, Dartmouth NS (CAN)
Abstract
In today’s world, microengineering is on the threshold of new technological breakthroughs in many applications, such as microfluidics, bio-medical imaging, microscopy, and microphotonics. However, sensors are not being fabricated for the demands imposed by current and future applications. In this regard, sensors need to be engineered and optimized for a given application. Harsh environments, size requirements, data transfer, and sensor packaging are a few of the issues needing to be addressed. For aerospace applications, size and weight considerations are very important, as are the limitations imposed by the harsh operating environment of a gas turbine engine. The advent of micro-electro-mechanical-systems technology, advanced microfabrication and modeling capabilities has brought about interest in the development of intelligent sensor systems. Micro-sensor technologies are expected to play a significant role in such development. Using silicon microfabrication processes, it has been suggested that common sensors could be replaced or complemented with miniaturized, high reliability, low-cost, low-power and batch manufactured micro-sensors. A silicon-on-insulator transducer is introduced for possible pressure sensing applications in high temperature engine components and compartments. A case study is presented in which the effects of mass and surface stress are investigated for microcantilever sensor applications. A theoretical formulation based on the Rayleigh-Ritz energy ap

Il y a un résumé en français ici.

Report Number
DRDC-ATLANTIC-TM-2009-081 — Technical Memorandum
Date of publication
01 Apr 2009
Number of Pages
84
DSTKIM No
CA032439
CANDIS No
531613
Format(s):
Electronic Document(PDF)

Permanent link

Document 1 of 1

Date modified: